PVDF(DS202D) Resin Mo Nga Rawa Hiko Hiko Lithium Binder Materials
Ko te paura PVDF DS202D ko te homopolymer o te vinylidene fluoride, ka taea te whakamahi mo nga taputapu hiko hiko i roto i te pākahiko lithium. Ko te DS202D he momo polyvinylidene fluoride me te taumaha molecular teitei.Ko te whakarewa i roto i te polar organic solvent. te hanga kiriata ngawari.Ko te mea hiko e hangaia ana e te PVDF DS202D he pai te pumau matū, te pumau o te pāmahana me te pai o te mahi.I te mea ko tetahi o nga here, ka whakamahia nuitia te PVDF i roto i te waahi o nga papahiko lithium-ion.Ka honoa e ia nga mea hiko hiko, te kaihoko kawe me te kaikohi o naianei ki a raatau ano, ko te mahi me te inenga o te PVDF binder ka whai mana nui ki te mahi hiko o te pākahiko lithium.Ko te tikanga, ka taea e te adhesion teitei te whakapai ake i te huringa ora o te pākahiko lithium, a ko nga mea matua e pa ana ki te adhesion ko te taumaha ngota me te tioata.
He rite ki te Q/0321DYS014
Taurangi Hangarau
| Tūemi | Waeine | 202B | DS202D | DS202E | Tikanga Whakamātautau / Paerewa | ||
| Te ahua | / | Te paura ma | Te paura ma | Te paura ma | / | ||
| Te kakara | / | Kore | Kore | Kore | / | ||
| Iwi Whakarewa | ℃ | 156-165 | 156-165 | 156-165 | GB/T28724 | ||
| Te Weahanga Whakapoapoa,≥ | ℃ | 380 | 380 | 380 | GB/T33047 | ||
| Kiato Paanga | / | 1.75-1.79 | 1.75-1.79 | 1.75-1.79 | GB/T1033 | ||
| Makuku,≤ | ％ | 0.10 | 0.10 | 0.10 | GB/T6284 | ||
| Poneke | MPa | 8500-22000 | / | / | 25 ℃ 0.1g/gNMP | ||
| / | 1000-5000 | 2000-5000 | 25 ℃ 0.07g/gNMP | ||||
Taupānga
Ka whakamahia te kapia ki nga rauemi whakakao hiko hiko lithium.
Te aro
Puritia tenei hua mai i te pāmahana teitei hei aukati i te tuku hau paitini i te pāmahana i runga ake i te 350 ℃.
Mōkī, Te Waka me te Rokiroki
1.Packed i roto i te pahu kirihou, me nga oko porohita cutside, 20kg/drum.
2.Kua tiakina ki nga waahi ma, maroke hoki, me te awhe pāmahana ko te 5-30 ℃. Avoid contamination from dust and moisture.
3.Me kawe te hua hei hua kore-kino, te karo i te wera, te makuku me te wiri kaha.
